LOCTITE ABLESTIK 84-1LMISR4

LOCTITE ABLESTIK 84-1LMISR4, Epoxy, Die attach LOCTITE® ABLESTIK 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of LOCTITE ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.

• Conductive
• Box oven cure
• Excellent dispensability, minimal tailing and stringing

Application Method	Dispense System
Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	40.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	150.0 ppm/°C
Color	Silver
Cure Schedule, @ 175.0 °C	1.0 hr.
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
Glass Transition Temperature (Tg)	120.0 °C
Key Characteristics	Adhesion: Excellent Adhesion, Conductivity: Electrically Conductive, Conductivity: Thermally Conductive, Dispensable, Dispensibility: Easy Dispensibility, Dispensibility: Good Dispensibility, Filler: Ag Filled, Freeze-Thaw Stable, Modulus: High Modulus, Process Efficiency: Very High, Strength: High Strength, Thermal Stability: Excellent Thermal Stability, Usability: Easy to Use
Moisture Absorption, 168 hr. @ 85°C/85% RH	0.6 %
Number of Components	1 Part
Physical Form	Paste
Substrates	LeadFrame: Gold, LeadFrame: Silver
Technology	Epoxy
Tensile Modulus, @ 250.0 °C	300.0 N/mm² (44000.0 psi )
Thermal Conductivity	2.5 W/mK
Thixotropic Index	5.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	8000.0 mPa·s (cP)
Volume Resistivity	≤ 0.0002 Ohm cm