LOCTITE ABLESTIK 8200T

LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive LOCTITE® ABLESTIK 8200T electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.

• Excellent adhesion to Ag plated LF
• Snap curable
• Low bleed
• Oven Curable

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	61.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	9.0 ppm
Extractable Ionic Content, Potassium (K+)	29.0 ppm
Extractable Ionic Content, Sodium (Na+)	9.0 ppm
Hot Die Shear Strength	7.0 kg-f
RT Die Shear Strength	10.0 kg-f
Tensile Modulus, @ 250.0 °C	2921.0 N/mm² (423655.0 psi )