LOCTITE ABLESTIK 6200

LOCTITE ABLESTIK 6200, Proprietary Hybrid Chemistry, Die attach LOCTITE® ABLESTIK 6200 B-stageable adhesive is designed for use in flex or laminated based substrates. This material is ideal for chip scale packages where tolerance and bleed need to be minimized.

• Low moisture uptake
• Stencil printing
• Low bleed

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	94.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	237.0 ppm/°C
Color	Yellow
Cure Schedule, @ 175.0 °C 30 min. ramp	90.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	-10.0 °C
Hot Die Shear Strength, @ 245.0 °C 2 x 2 mm, die - ceramic to ceramic	2.9 kg-f
RT Die Shear Strength, 2 x 2 mm, die - ceramic to ceramic	18.5 kg-f
Thixotropic Index	2.7
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	21000.0 mPa·s (cP)