LOCTITE ABLESTIK 3230 Így ismerik: Ablebond 3230

LOCTITE ABLESTIK 3230, Epoxy, Die Attach LOCTITE® ABLESTIK 3230 electrically conductive die attach adhesive is designed for high reliability package applications. It can be used in a variety of package sizes.

• Low stress
• Improved JEDEC performance
• Fast cure
• Excellent adhesion to copper

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	80.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	205.0 ppm/°C
Color	Silver
Cure Schedule, Alternate ≤ 175.0 °C 40 min. ramp	55.0 min.
Cure Schedule, Recommended @ 175.0 °C 30 min. ramp	45.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	37.0 °C
RT Die Shear Strength, 2 x 2 mm, Si die Ag/Cu LF	15.0 kg-f
Thixotropic Index	5.6
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9500.0 mPa·s (cP)
Volume Resistivity	0.05 Ohm cm