LOCTITE ABLESTIK ECF 563

LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly LOCTITE® ABLESTIK ECF 563 epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.

• Electrically conductive
• Thermally conductive
• Low squeeze-out during bonding
• Thin, uniform bondline control
• Electrically conductive in the x, y, and Z axis

Carrier Film Thickness	25.0 µm
Cure Schedule, @ 150.0 °C	30.0 min.
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	88.0 °C
Physical Form	Film
Shear Strength, Aluminum	2500.0 psi
Technology	Epoxy
Thermal Conductivity	1.0 W/mK