LOCTITE ECCOBOND NCP 5209

LOCTITE ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.

• High purity
• Non-conductive
• Excellent protection of electrical joints
• Compatible with small assembly gap and tight pitches

Coefficient of Thermal Expansion (CTE), Above Tg	80.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Below Tg	28.0 ppm/°C
Extractable Ionic Content, Chloride (CI-)	10.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
Glass Transition Temperature (Tg)	145.0 °C
Storage Modulus, DMA @ 25.0 °C	7.3 GPa (7300.0 N/mm² , 1058775.0 psi )
Storage Temperature	-40.0 °C
Viscosity, @ 25.0 °C Spindle 51, speed 5 rpm	12500.0 mPa·s (cP)