LOCTITE ABLESTIK ATB F125E

LOCTITE ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal. LOCTITE® ABLESTIK ATB F125E adhesive film is formulated for use in wafer lamination processes or as a preform decal.

• Excellent workability
• Ideal modulus for wide range of package sizes
• Meets thin wafer requirements
• High reliability

Adhesive Film Thickness	25.0 µm
Application Method	Lamination
Applications	Die Attach
Carrier Type	Polyolefin
Color	White
Cure Type	Heat Cure, UV Cure
Dicing Tape Diameter	12.0
Extractable Ionic Content, Chloride (CI-)	19.0 ppm
Extractable Ionic Content, Potassium (K+)	1.0 ppm
Extractable Ionic Content, Sodium (Na+)	2.0 ppm
Hot Die Shear Strength, @ 260.0 °C 2.5 x 2.5 mm Si die on BT substrate	3.1 kg-f
Key Characteristics	Work Life: Long Work Life
Moisture Absorption	0.78 %
Physical Form	Film
Substrates	Laminate
Technology	Epoxy
Tensile Modulus, @ 250.0 °C	185.0 N/mm² (26831.0 psi )
Wafer Diameter	12.0
Weight Loss, TGA @ 200.0 °C	0.27 %