LOCTITE ABLESTIK 933-1

LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests. LOCTITE ABLESTIK 933-1 encapsulant exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.

• Electrically Insulating
• One component
• Provides environmental and mechanical protection

Applications	Encapsulating
Cure Schedule, @ 125.0 °C	2.0 hr.
Cure Type	Heat Cure
Number of Components	1 Part
Storage Temperature	-40.0 °C
Technology	Epoxy
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	360500.0 mPa·s (cP)