LOCTITE ABLESTIK 8387BM

LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications.

• Black pigmentation for blocking stray light
• Non-conductive

Applications	Encapsulating
Cure Schedule, @ 100.0 °C	1.0 hr.
Cure Type	Heat Cure
Number of Components	1 Part
Technology	Epoxy
Thixotropic Index	4.5
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	9200.0 mPa·s (cP)