LOCTITE ABLESTIK 526W01

LOCTITE ABLESTIK 526W01, Epoxy, Assembly LOCTITE® ABLESTIK 526W01 is designed to protect wire bonds and bare die. This material has also been tested to withstand multiple exposures to 260 °C reflow.

• Controlled flow
• One component
• Low CTE
• Low stress

Cure Schedule, @ 150.0 °C	45.0 min.
Cure Type	Heat Cure
Number of Components	1 Part
Operating Temperature	-50.0 - 260.0 °C
Storage Temperature	27.0 °C
Substrates	Ceramic
Technology	Epoxy
Viscosity, Brookfield CP52, @ 25.0 °C Speed 1 rpm	400000.0 mPa·s (cP)