LOCTITE ABLESTIK ABP 8415

LOCTITE ABLESTIK ABP 8415, Epoxy, Die attach LOCTITE® ABLESTIK ABP 8415 adhesive is designed for die attach applications.

• Wire bondable
• Good adhesion
• One component
• Solvent-free

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	60.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	210.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	35.0 °C
Thixotropic Index	3.25
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	16000.0 mPa·s (cP)