LOCTITE ABLESTIK ABP 2288A

LOCTITE ABLESTIK ABP 2288A, Proprietary Hybrid Chemistry, Die Attach, Sintering Silver Paste LOCTITE® ABLESTIK ABP 2288A die attach adhesive is designed for use in leadframe applications

• Low cost
• Use for wide range of package sizes

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	80.0 ppm/°C
Coefficient of Thermal Expansion (CTE), Above Tg	170.0 ppm/°C
Cure Type	Heat Cure
Glass Transition Temperature (Tg)	13.0 °C
Thermal Conductivity	0.6 W/mK
Thixotropic Index	4.4
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm	8500.0 mPa·s (cP)