LOCTITE ABLESTIK 2902

LOCTITE ABLESTIK 2902, Epoxy, Bonding, Sealing or Repair LOCTITE® ABLESTIK 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. LOCTITE ABLESTIK 2902 passes NASA outgassing standards.

• Electrically conductive
• Thermally conductive
• Solvent-free
• High adhesion

Cure Schedule, Recommended @ 25.0 °C	24.0 hr.
Cure Type	Room Temperature (Ambient) Cure
Number of Components	2 Part
Operating Temperature	-60.0 - 110.0 °C
Physical Form	Paste
Shear Strength, Aluminum	700.0 psi
Storage Temperature	27.0 °C
Substrates	Ceramic
Technology	Epoxy
Viscosity CP52, Speed 10 rpm	20000.0 mPa·s (cP)
Volume Resistivity, 24 hr. @ 25°C	0.001 Ohm cm