LOCTITE ABLESTIK QMI529HT

LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.

• Electrically conductive
• Thermally conductive
• Void-free bondline
• Hydrophobic

Applications	Die Attach
Coefficient of Thermal Expansion (CTE)	53.0 ppm/°C
Cure Type	Heat Cure
Extractable Ionic Content, Chloride (CI-)	20.0 ppm
Extractable Ionic Content, Fluoride (F-)	20.0 ppm
Extractable Ionic Content, Potassium (K+)	20.0 ppm
Extractable Ionic Content, Sodium (Na+)	20.0 ppm
Hot Die Shear Strength, @ 245.0 °C 7.62 x 7.62 mm die on Ag/Cu leadframe	21.0 kg-f
Key Characteristics	Conductivity: Electrically Conductive, Conductivity: Thermally Conductive
Number of Components	1 Part
Physical Form	Paste
RT Die Shear Strength, 7.62 x 7.62 mm die on Ag/Cu leadframe	57.0 kg-f
Substrates	LeadFrame: Gold, LeadFrame: Silver
Technology	Acrylate
Tensile Modulus, @ 25.0 °C	3300.0 N/mm² (478500.0 psi )
Thixotropic Index	4.8