LOCTITE ABLESTIK ATB 130

LOCTITE ABLESTIK ATB 130, Rubberized Epoxy, Die Attach LOCTITE® ABLESTIK ATB 130 adhesive film is formulated for use in wafer lamination processess. It combines process ease with the proven reliability of a hybrid chemistry-based die attach material. LOCTITE ABLESTIK ATB 130 is pre-applied to a modified dicing tape for easy pick-up and one step lamination.

• Easy die pick up
• Excellent wettability
• One step lamination
• Excellent package reliability

Adhesive Film Thickness	30.0 µm
Carrier Film Thickness	85.0 µm
Dicing Tape Diameter	12.0
Extractable Ionic Content, Chloride (CI-)	10.0 ppm
Extractable Ionic Content, Potassium (K+)	10.0 ppm
Extractable Ionic Content, Sodium (Na+)	10.0 ppm
Hot Die Shear Strength	2.0 kg-f
RT Die Shear Strength	15.0 kg-f
Tensile Modulus, DMTA @ 250.0 °C	8.6 N/mm² (1250.0 psi )
Wafer Diameter	12.0
Weight Loss, @ 300.0 °C	1.0 %